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1.
On-chip demonstration of carbon nanotube interconnects
by Close, Gael F., Ph.D.  Stanford University. 2008: 134 pages; 3313812.
2.
Design Automation for Carbon Nanotube Circuits Considering Performance and Security Optimization
by Liu, Lin, Ph.D.  Michigan Technological University. 2017: 169 pages; 10267186.
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Three-Dimensional Inkjet-Printed Metal Nanoparticles: Ink and Application Development
by Sadie, Jacob Alexander, Ph.D.  University of California, Berkeley. 2015: 158 pages; 10187734.
8.
Silicon Micro-ring Resonator Device Design for Optical Interconnect Systems
by Li, Yunchu, Ph.D.  University of Southern California. 2013: 110 pages; 3563933.
9.
Spontaneous Emission Rate Enhancement Using Optical Antennas
by Kumar, Nikhil, Ph.D.  University of California, Berkeley. 2013: 72 pages; 3593887.
10.
Performance-Driven Communication Architecture Design in Irregular, Overlaid and Hybrid Mesh Wireless NoC
by Wu, Ruizhe, Ph.D.  University of Louisiana at Lafayette. 2014: 108 pages; 3622964.
12.
Photonic Links: From Theory to Automated Design
by Settaluri, Krishna Tej, Ph.D.  University of California, Berkeley. 2018: 120 pages; 13423776.
13.
Rapid laser crystallization of semiconductors for three-dimensional integration
by Witte, Daniel Jonathan, Ph.D.  Stanford University. 2009: 177 pages; 3364516.
15.
Carrier transport in dirac-band materials and their device physics
by Gupta, Gaurav, Ph.D.  National University of Singapore (Singapore). 2015: 239 pages; 10006002.
16.
Flexible active matrix displays and integrated amorphous silicon source drivers
by Venugopal, Sameer M., Ph.D.  Arizona State University. 2007: 121 pages; 3270625.
17.
Assessment of Properties of Transient Liquid Phase Sintered (TLPS) Interconnects by Simulation and Experiments
by Greve, Hannes Martin Hinrich, Ph.D.  University of Maryland, College Park. 2017: 320 pages; 10270347.
18.
Direct write fabrication of waveguides and interconnects for optical printed wiring boards
by Dingeldein, Joseph C., Ph.D.  Michigan Technological University. 2012: 107 pages; 3542522.
19.
Properties of PEG, PPG and their copolymers influence on the gap-fill characteristics of damascene interconnects
by Ryan, Kevin J., Ph.D.  State University of New York at Albany. 2013: 135 pages; 3566568.
22.
Integration of atomic layer deposition-grown copper for advanced interconnect applications
by Wu, Liqi, Ph.D.  State University of New York at Albany. 2008: 167 pages; 3327486.
23.
Microfabricated piezoresistive shear stress sensors for underwater applications
by Barlian, Arnoldus Alvin, Ph.D.  Stanford University. 2009: 236 pages; 3351486.
25.
Development of a high current high temperature SiC MOSFET based solid-state power controller
by Guo, Yuanbo, M.S.  State University of New York at Buffalo. 2011: 63 pages; 1488901.
26.
Hybrid Silicon Photonic Integration using Quantum Well Intermixing
by Jain, Siddharth R., Ph.D.  University of California, Santa Barbara. 2013: 196 pages; 3559799.
27.
Design and Analysis of Large Scale Nanophotonic On-Chip Networks
by Nitta, Christopher, Ph.D.  University of California, Davis. 2011: 141 pages; 3499474.
28.
Silicon Carbide Technologies for Interfacing with the Nervous System
by Diaz-Botia, Camilo Andres, Ph.D.  University of California, Berkeley. 2017: 87 pages; 10601720.
29.
Yield, Cost, Reliability, and Availability of Multi-Core System-on-Chips
by Shamshiri, Saeed, Ph.D.  University of California, Santa Barbara. 2011: 178 pages; 3473795.
30.
Chemical Mechanical Polishing of Ruthenium, Cobalt, and Black Diamond Films
by Peethala, Brown Cornelius, Ph.D.  Clarkson University. 2012: 148 pages; 3491072.
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