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1.
Development of a high current high temperature SiC MOSFET based solid-state power controller
by Guo, Yuanbo, M.S.  State University of New York at Buffalo. 2011: 63 pages; 1488901.
2.
Three-Dimensional Inkjet-Printed Metal Nanoparticles: Ink and Application Development
by Sadie, Jacob Alexander, Ph.D.  University of California, Berkeley. 2015: 158 pages; 10187734.
3.
Developing an empirical correlation for the thermal spreading resistance of a heat sink
by Werdowatz, Andrew R., M.S.  San Jose State University. 2016: 89 pages; 10128320.
4.
Evaluation of environmental tests for tin whisker assessment
by Panashchenko, Lyudmyla, M.S.  University of Maryland, College Park. 2009: 141 pages; 1474312.
6.
Packaging of services with base goods
by Eilat, Assaf, Ph.D.  Stanford University. 2008: 49 pages; 3313813.
9.
Microfabrication and analysis of manifold microchannel coolers for power electronics
by Boteler, Lauren Marie, Ph.D.  University of Maryland, College Park. 2011: 366 pages; 3461087.
10.
Application of Advanced Power Electronics in Renewable Energy Sources and Hybrid Generating Systems
by Esmaili, Gholamreza, Ph.D.  The Ohio State University. 2006: 147 pages; 10835744.
11.
On the Estimation of Switching Loss in Wide Band-Gap Power Electronics Systems
by New, Christopher D., M.S.  The University of Alabama. 2019: 107 pages; 27545901.
12.
Packaging Politics
by Galloway, Catherine Suzanne, Ph.D.  University of California, Berkeley. 2012: 110 pages; 3555682.
13.
Numerical simulation of stress generation and whisker growth in tin films
by Buchovecky, Eric J., Ph.D.  Brown University. 2010: 152 pages; 3430162.
14.
Assessment of Properties of Transient Liquid Phase Sintered (TLPS) Interconnects by Simulation and Experiments
by Greve, Hannes Martin Hinrich, Ph.D.  University of Maryland, College Park. 2017: 320 pages; 10270347.
17.
Mechanism of retroviral genomic RNA dimerization and packaging
by Gherghe, Cristina, Ph.D.  The University of North Carolina at Chapel Hill. 2007: 126 pages; 3272569.
18.
Single molecule studies of a viral DNA packaging motor
by Karunakaran, Aathavan, Ph.D.  University of California, Berkeley. 2007: 143 pages; 3306032.
19.
Evaluating a new plant startup in the rigid plastics packaging industry
by Lehner, Carmen, M.S.  Pepperdine University. 2016: 84 pages; 10142125.
20.
Current practices in pharmaceutical container closure development
by Mauzey, Duane L., D.R.Sc.  University of Southern California. 2012: 138 pages; 3514255.
21.
Smart Packaging: A Novel Technique For Localized Drug Delivery For Ovarian Cancer
by Williams, Eva Christabel, Ph.D.  University of South Florida. 2012: 144 pages; 3518740.
22.
Light Effects on Soy Oil and Soymilk Influence Oxidation, Product Quality, and Packaging Decisions
by Bianchi, Laurie Marie, Ph.D.  Virginia Polytechnic Institute and State University. 2014: 230 pages; 10647314.
24.
Development and application of systems engineering principles for improving the manufacturing process of an electronics co.
by Paustell, Khristine Larae, M.S.  California State University, Long Beach. 2015: 63 pages; 1603746.
26.
Two-Dimensional Nanoparticle-Molecule Arrays for Molecular Electronics and Thermoelectrics
by McCold, Cliff E., Ph.D.  University of California, Davis. 2018: 135 pages; 10687141.
28.
When code meets place: Collaboration and innovation at WiFi hotspots
by Forlano, Laura, Ph.D.  Columbia University. 2008: 228 pages; 3333485.
29.
Perceptions of electronic technology impacts upon human resource professionals
by Polen, Lloyd L., III, Ph.D.  University of Phoenix. 2009: 168 pages; 3381828.
30.
Self-Timed Circuits, Memories, and Power Electronics for High-Ripple Energy Harvesting Power Supplies
by Wenck, Justin A., Ph.D.  University of California, Davis. 2010: 258 pages; 3427486.
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