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1.
On-chip demonstration of carbon nanotube interconnects
by Close, Gael F., Ph.D.  Stanford University. 2008: 134 pages; 3313812.
2.
Design Automation for Carbon Nanotube Circuits Considering Performance and Security Optimization
by Liu, Lin, Ph.D.  Michigan Technological University. 2017: 169 pages; 10267186.
4.
Integration of atomic layer deposition-grown copper for advanced interconnect applications
by Wu, Liqi, Ph.D.  State University of New York at Albany. 2008: 167 pages; 3327486.
5.
Effect of joule heating on the reliability of stamped metal land grid array sockets
by Challa, Vidyullatha, Ph.D.  University of Maryland, College Park. 2010: 109 pages; 3443431.
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Rapid laser crystallization of semiconductors for three-dimensional integration
by Witte, Daniel Jonathan, Ph.D.  Stanford University. 2009: 177 pages; 3364516.
9.
Impingement heat sink optimization and thermal characterization of a power module using commercially available CFD code
by Chakravorty, Shiladitya, M.S.  State University of New York at Binghamton. 2011: 80 pages; 1499658.
10.
Chemical Mechanical Polishing of Ruthenium, Cobalt, and Black Diamond Films
by Peethala, Brown Cornelius, Ph.D.  Clarkson University. 2012: 148 pages; 3491072.
11.
Assessment of Properties of Transient Liquid Phase Sintered (TLPS) Interconnects by Simulation and Experiments
by Greve, Hannes Martin Hinrich, Ph.D.  University of Maryland, College Park. 2017: 320 pages; 10270347.
12.
Three-Dimensional Inkjet-Printed Metal Nanoparticles: Ink and Application Development
by Sadie, Jacob Alexander, Ph.D.  University of California, Berkeley. 2015: 158 pages; 10187734.
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Physical planning to embrace interconnect dominance in power and performance
by Wang, Renshen, Ph.D.  University of California, San Diego. 2010: 60 pages; 3404703.
17.
New precursors and chemistry for the growth of transition metal films by atomic layer deposition
by Knisley, Thomas Joseph, Ph.D.  Wayne State University. 2012: 119 pages; 3544670.
18.
A gigabit multi-drop interconnect with impedance matching network
by Ye, Zhijing, M.S.  Southern Methodist University. 2016: 47 pages; 10109007.
19.
Microgripper force feedback integration using piezoresistive cantilever structure
by Simon, Todd R., M.S.  Rochester Institute of Technology. 2008: 86 pages; 1460282.
21.
Self assembled structures for 3D integration
by Rao, Madhav, Ph.D.  The University of Alabama. 2012: 140 pages; 3511075.
22.
Fracture and fatigue of ultrathin nanoporous polymer films
by Kearney, Andrew V., Ph.D.  Stanford University. 2008: 128 pages; 3313821.
24.
Pyrolysis Studies of Copper and Copper Phosphate Mixtures on a Tungsten Surface
by Poudyal Kharel, Aryashree, M.S.  Southern Illinois University at Edwardsville. 2015: 61 pages; 10016914.
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Properties of PEG, PPG and their copolymers influence on the gap-fill characteristics of damascene interconnects
by Ryan, Kevin J., Ph.D.  State University of New York at Albany. 2013: 135 pages; 3566568.
28.
Electron Scattering at Surfaces and Interfaces of Transition Metals
by Zheng, Pengyuan, Ph.D.  Rensselaer Polytechnic Institute. 2015: 113 pages; 10010793.
29.
Effects of Predatory Cues on Copper Sensitivity and Metabolic Rate in Gambusia affinis
by Campbell, Melissa, M.S.  East Tennessee State University. 2017: 50 pages; 13830164.
30.
Direct write fabrication of waveguides and interconnects for optical printed wiring boards
by Dingeldein, Joseph C., Ph.D.  Michigan Technological University. 2012: 107 pages; 3542522.
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