This thesis presents the development of MEMS capacitive temperature sensors, and the investigation of the time history of the adhesion force between MEMS polycrystalline silicon surfaces. Both devices consist of bilayer silicon-gold beams acting as an out-of-plane thermal actuator and a set of capacitive electrodes. The temperature sensors are designed, simulated and manufactured, and their performance is analyzed experimentally. Changes in different dimensions such as the beams length and thicknesses of its metal layer are a way of analyzing the device’s performance using ANSYS®. The sensitivity of the C-T response can change and offer a highly sensitive sensor in a given temperature range by changing the device’s dimension. Moreover, a different set of capacitive test structures were designed and fabricated to investigate the relation between adhesion force and contact time in polycrystalline silicon surfaces. The contact is created without actuation; thus, the surfaces can remain in contact while the device is stored for a long period. They are separated using an out-of-plane thermal actuator. The adhesion between the two surfaces creates a hysteresis loop in the displacement-temperature response of the system which is used to determine the adhesion force. Using the experimental data of the devices tested in long- and short-terms contact, the adhesion force is extracted and measured by finite element analysis. The test results show that the adhesion force for the devices remaining in contact for a long period of time is drastically higher than those with short-term contact. The adhesion force values as large as 2.5 µN for long-term contact and as small as 0.4 µN have been measured using this novel test structure.
|Commitee:||Celik, Serdar, Darabi, Jeff|
|School:||Southern Illinois University at Edwardsville|
|School Location:||United States -- Illinois|
|Source:||MAI 58/01M(E), Masters Abstracts International|
|Keywords:||Adhesion force, Bilayer beams, Capacitance temperature sensors, Long and short term contact, MEMS devices, Out-of-plane thermal actuators|
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