Dissertation/Thesis Abstract

Thermal Characterization of Copper-Carbon Nanotube Micropillars for Electronic Cooling Applications
by Rojo, Gerardo, M.S., Southern Illinois University at Edwardsville, 2018, 92; 10808334
Abstract (Summary)

Thermal management plays a very important role in electronic systems. Traditional fan cooled heat sinks have been utilized for several decades as the most cost-effective cooling technique for electronic cooling applications. However, with the development of new high heat flux 3D chips, more efficient cooling systems are required to remove such high heat fluxes. The proposed project aims to address this issue by developing a capillary-driven two-phase cooling system that combines a microstructure wick with the high energy removal rate of evaporation. The wick structure consists of mushroom-like composite micropillars. The small spacing between micropillar heads provides a large capillary pressure whereas the large spacing between the base of micropillars provides a high permeability for liquid flow. The proposed micropillar array is fabricated by an electroplating technique on a copper substrate. Micropillars array was tested in a controlled environment to experimentally measure its thermal characterization under several operating conditions. In addition, a computational study was conducted using Ansys Fluent to model and compare the thermal performance of the micropillar array with experimental results.

Indexing (document details)
Advisor: Darabi, Jeff
Commitee: Molki, Majid, Yan, Terry X.
School: Southern Illinois University at Edwardsville
Department: Mechanical and Industrial Engineering
School Location: United States -- Illinois
Source: MAI 57/05M(E), Masters Abstracts International
Subjects: Thermodynamics, Mechanical engineering
Keywords: Computer chip, Cooling technique, Micropillars
Publication Number: 10808334
ISBN: 978-0-355-97270-2
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