Thermal management plays a very important role in electronic systems. Traditional fan cooled heat sinks have been utilized for several decades as the most cost-effective cooling technique for electronic cooling applications. However, with the development of new high heat flux 3D chips, more efficient cooling systems are required to remove such high heat fluxes. The proposed project aims to address this issue by developing a capillary-driven two-phase cooling system that combines a microstructure wick with the high energy removal rate of evaporation. The wick structure consists of mushroom-like composite micropillars. The small spacing between micropillar heads provides a large capillary pressure whereas the large spacing between the base of micropillars provides a high permeability for liquid flow. The proposed micropillar array is fabricated by an electroplating technique on a copper substrate. Micropillars array was tested in a controlled environment to experimentally measure its thermal characterization under several operating conditions. In addition, a computational study was conducted using Ansys Fluent to model and compare the thermal performance of the micropillar array with experimental results.
|Commitee:||Molki, Majid, Yan, Terry X.|
|School:||Southern Illinois University at Edwardsville|
|Department:||Mechanical and Industrial Engineering|
|School Location:||United States -- Illinois|
|Source:||MAI 57/05M(E), Masters Abstracts International|
|Subjects:||Thermodynamics, Mechanical engineering|
|Keywords:||Computer chip, Cooling technique, Micropillars|
Copyright in each Dissertation and Thesis is retained by the author. All Rights Reserved
The supplemental file or files you are about to download were provided to ProQuest by the author as part of a
dissertation or thesis. The supplemental files are provided "AS IS" without warranty. ProQuest is not responsible for the
content, format or impact on the supplemental file(s) on our system. in some cases, the file type may be unknown or
may be a .exe file. We recommend caution as you open such files.
Copyright of the original materials contained in the supplemental file is retained by the author and your access to the
supplemental files is subject to the ProQuest Terms and Conditions of use.
Depending on the size of the file(s) you are downloading, the system may take some time to download them. Please be