The rapidly evolving global information infrastructure requires ever faster data transfer within computer networks and stations. Integrated chip scale photonics can pave the way to accelerated signal manipulation and boost bandwidth capacity of optical interconnects in a compact and ergonomic arrangement. A key building block for integrated photonic circuits is an on-chip laser. In this dissertation we explore ways to reduce the physical footprint of semiconductor lasers and make them suitable for high density integration on silicon, a standard material platform for today's integrated circuits. We demonstrated the first room temperature metalo-dielectric nanolaser, sub-wavelength in all three dimensions. Next, we demonstrated a nanolaser on silicon, showing the feasibility of its integration with this platform. We also designed and realized an ultracompact feedback laser with edge-emitting structure, amenable for in-plane coupling with a standard silicon waveguide. Finally, we discuss the challenges and propose solutions for improvement of the device performance and practicality.
|Commitee:||Lomakin, Vitaliy, Meng, Shirley, Schuller, Ivan, Tu, Charles|
|School:||University of California, San Diego|
|Department:||Electrical Engineering (Photonics)|
|School Location:||United States -- California|
|Source:||DAI-B 76/08(E), Dissertation Abstracts International|
|Subjects:||Electrical engineering, Nanotechnology, Optics|
|Keywords:||Distributed feedback lasers, Gratings, Nanofabrication, Nanolasers, Semiconductors, Wafer bonding|
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