Dissertation/Thesis Abstract

Microhotplate for Low Power and Ultra Dense Gaseous Sensor Arrays using Recessed Silica Aerogel for Heat Insulation
by Kumar, Sanjay, M.S., University of Louisiana at Lafayette, 2013, 109; 1553875
Abstract (Summary)

In the operation of an air pitted gaseous sensors, the microhotplate (µHP) consumes almost all the power used by the sensor. The required area to micromachine the air pit for the µHP of a single sensor is several times more than the actual area required by the sensor itself. The feasibility of implementing low power and ultra-dense gaseous sensor array is investigated by developing a new µHP structure using recessed silica aerogel. In comparison with the conventional µHP structure, the recessed aerogel not only has decreased the utilized area of the chip almost tenfold (181 × 181 µm2 vs. 573 × 573 µm2) but also has decreased the power consumed by each µHP more than two fold (54 nW vs. 30 nW) to maintain the temperature of 360ºC. Using the new structure, as the number of sensors increases in a sensor array, the saved area of the chip increases quadratic. Moreover, the power consumed by the new designed structure reduces drastically.

Indexing (document details)
Advisor: Madani, Mohammad
Commitee: Fekih, Afef, Pan, Zhongqi
School: University of Louisiana at Lafayette
Department: Electrical Engineering
School Location: United States -- Louisiana
Source: MAI 52/06M(E), Masters Abstracts International
Subjects: Electrical engineering, Energy
Publication Number: 1553875
ISBN: 978-1-303-82132-5
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